Die alignment: In semiconductor packaging, tiny dies need to be neatly arranged onto specific jigs or carriers for subsequent die bonding, wire bonding, and other processes. Through precise vibration, swing and control mechanism, the arranger can quickly and accurately arrange the dies poured into the trough at the designated position of the jig plate in a unified direction and angle, and can arrange the extremely small chips to meet the packaging needs of different size chips.

Solder lug alignment: Solder lugs are an important material used in semiconductor packages to connect chips and lead frames, etc. The aligner can arrange the scattered solder lugs in the correct posture and position, which is convenient for the automatic packaging equipment to accurately pick up and weld and improve the quality and consistency of welding.

Jumper alignment: Jumper is also more common in semiconductor packaging, and the whole column machine can arrange the jumper in the direction and front and back at high speed according to the requirements to meet the speed requirements of the next process of the robotic arm sucking and welding.

Lead frame alignment: A lead frame is the chip carrier of an integrated circuit, which needs to be aligned during the packaging process for accurate electrical connection and mechanical fixation with the chip. Some fully automatic packaging systems will include a lead frame alignment unit. Through a special mechanism and control algorithm, the lead frame is organized into a neat queue and sent to the subsequent packaging process to ensure the accuracy of the package.

Resin alignment: In the semiconductor molding process, the molding resin material needs to be loaded with alignment. The automatic resin loading machine puts the qualified plastic resin material into the barrel or sends it to the designated position for the use of packaging equipment through vibration arrangement, detection and judgment, manipulator loading, etc., which improves the automation degree of the production process, reduces the mixing of impurities, and ensures product quality.