Die Sorting: In semiconductor packaging, tiny dies must be precisely aligned onto specific fixtures in order to carry out subsequent processes such as die attachment and wire bonding. Parts aligners use precise vibration, oscillation, and control mechanisms to rapidly and accurately align dies which were poured into material trays into designated positions on fixture plates, ensuring uniform orientation and angle. These machines can handle extremely small-sized chips, meeting packaging requirements for dies of varying dimensions.

• Solder Piece Sorting: Solder pieces are critical materials in semiconductor packaging for connecting chips to lead frames. Parts aligners align scattered solder pieces into the correct orientation and position, enabling automated packaging equipment to accurately pick and weld them. This improves welding quality and consistency.

• Jumper Wire Sorting: Jumper wires are commonly used in semiconductor packaging. Parts aligners can rapidly align jumper wires by direction and orientation (front/back), meeting the speed requirements for robotic arm pickup and welding in downstream processes.

• Lead Frame Sorting: Lead frames serve as chip carriers in integrated circuits and require alignment during packaging to ensure precise electrical connections and mechanical fixation. Some fully automated packaging systems include lead frame sorting units. Using specialized mechanisms and control algorithms, these units organize lead frames into neat queues for subsequent packaging steps, ensuring encapsulation accuracy.

• Resin Sorting: During semiconductor molding, resin pellets must be sorted and loaded. Automatic resin sorting and loading machines employ vibration-based alignment, inspection and judgment, and robotic handling to arrange qualified resin pellets into designated barrels or positions for use by packaging equipment. This enhances the degree ofautomation, reduces contamination risks, and ensures product quality.